Superseded
Standard
Historical
IEC 60749-39:2006
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
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Summary
Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.
These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 07/24/2006 |
| Release Date | 07/24/2006 |
| Cancellation Date | 11/29/2021 |
| Edition | 1 |
| Page Count | 19 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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