Superseded
Standard
Historical
IEC 60749-34:2004
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Preview
Summary
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/10/2004 |
| Release Date | 03/10/2004 |
| Cancellation Date | 10/28/2010 |
| Edition | 1 |
| Page Count | 21 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Previous versions
10/03/2004
Superseded
Historical
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