Superseded
Standard
Historical
IEC 60749-3:2002
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
Preview
Summary
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.
The contents of the corrigendum of August 2003 have been included in this copy.
The contents of the corrigendum of August 2003 have been included in this copy.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/09/2002 |
| Release Date | 04/09/2002 |
| Cancellation Date | 03/03/2017 |
| Edition | 1 |
| Page Count | 7 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Previous versions
09/04/2002
Superseded
Historical
No products.