Superseded
Standard
Historical
IEC 60749-21:2004
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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Summary
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/15/2004 |
| Release Date | 03/15/2004 |
| Cancellation Date | 04/07/2011 |
| Edition | 1 |
| Page Count | 45 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Previous versions
15/03/2004
Superseded
Historical
07/04/2011
Superseded
Historical
09/12/2025
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