Superseded
Standard
Historical
IEC 60749-20:2002
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Preview
Summary
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
The contents of the corrigendum of August 2003 have been included in this copy.
The contents of the corrigendum of August 2003 have been included in this copy.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 09/30/2002 |
| Release Date | 09/30/2002 |
| Cancellation Date | 12/09/2008 |
| Edition | 1 |
| Page Count | 49 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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