Withdrawn
Standard
Most Recent
IEC 60249-3-3:1991
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
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Summary
Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board.
Solder resist for the uses considered in this specification may be of two types, as specified by the purchaser.
Provides three classes of requirements to reflect progressive increases in sophistication, functional performance requirements and testing severity.
Solder resist for the uses considered in this specification may be of two types, as specified by the purchaser.
Provides three classes of requirements to reflect progressive increases in sophistication, functional performance requirements and testing severity.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 06/04/1991 |
| Release Date | 06/04/1991 |
| Cancellation Date | 12/15/2004 |
| Edition | 1 |
| Page Count | 37 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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