Withdrawn
Standard
Most Recent
IEC 60249-3-1:1981
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
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Summary
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/01/1981 |
| Release Date | 01/01/1981 |
| Cancellation Date | 12/15/2004 |
| Edition | 2 |
| Page Count | 20 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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