Superseded
Standard
Historical
IEC 60249-2-13:1987
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
Preview
Summary
Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and supplier.
The material consists of an insulating flexible film base with copper foil bonded to one or both sides, with or without the use of an adhesive.
The material consists of an insulating flexible film base with copper foil bonded to one or both sides, with or without the use of an adhesive.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 09/30/1987 |
| Release Date | 09/30/1987 |
| Cancellation Date | 02/26/1999 |
| Edition | 1 |
| Page Count | 23 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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