IEC 60191-6-2:2001
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IEC 60191-6-2:2001

IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Summary

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 12/11/2001
Edition 1.0
Page Count 10
EAN ---
ISBN ---
Weight (in grams) ---

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