IEC 60191-6-2:2001/COR1:2002
Active Standard Corrigendum
Most Recent

IEC 60191-6-2:2001/COR1:2002

IEC 60191-6-2:2001/COR1:2002 Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
No description.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 10/18/2002
Edition 1.0
Page Count 0
EAN ---
ISBN ---
Weight (in grams) ---

Modifies

Replaced by

No products.
No products.
Contact us