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IEC 60191-5:1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
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Summary
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/23/1997 |
| Release Date | 04/23/1997 |
| Edition | 2 |
| Page Count | 71 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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