Superseded
Standard
Historical
IEC 60191-3B:1978
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement
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Summary
Completes IEC 60191-3 by defining in a more satisfactory manner the mounted length and width of DIL and QUIL packages and giving recommendations for the bending of terminals of QUIL packages used for the mounting of integrated circuits. It also lists the dimensions permitting the definition of the families of packages of Form 3 and Form 4.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/01/1978 |
| Release Date | 01/01/1978 |
| Cancellation Date | 10/29/1999 |
| Edition | 1 |
| Page Count | 10 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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