Superseded
Standard
Historical
IEC 60191-3A:1976
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement
Preview
Summary
Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/01/1976 |
| Release Date | 01/01/1976 |
| Cancellation Date | 10/29/1999 |
| Edition | 1 |
| Page Count | 11 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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