Superseded
Draft standard
Historical
DIN IEC 91/141/CD:1998-11
IEC 61190-1-1: Attachment materials for elektronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronic assembly (IEC 91/141/CD:1998)
Preview
Summary
IEC 61190-1-1: Anschlussmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Fluxmittel für hochwertige Verbindungen bei der Elektronikmontage (IEC 91/141/CD:1998)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 11/01/1998 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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