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DIN EN 60749-22:2003-12
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003.
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Summary
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit (Bond-Strength) (IEC 60749-22:2002 + Corr. 1:2003); Deutsche Fassung EN 60749-22:2003 / Achtung: Daneben gilt DIN EN 60749 (2002-09) unter besonderen Bedingungen noch bis 2005-10-01.
Notes
Under certain conditions, DIN EN 60749 (2002-09) remains valid alongside this standard until 2005-10-01.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 12/01/2003 |
| Page Count | 20 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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