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23/30469010 DC:2023
BS EN IEC 63378-3. Thermal standardization on semiconductor packages Part 3. circuit simulation models of discrete for transient analysis
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| Publisher | British Standards Institution (BSI) |
| Publication Date | 02/03/2023 |
| Page Count | 16 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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