Active
Draft standard
Most Recent
21/30446636 DC:2021
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
Preview
Summary
Printing board;Structures;Testing methods;Open systems interconnection
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 10/29/2021 |
| Page Count | 18 |
| Themes | Open systems interconnection |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
Replaces
Previous versions
No products.