Collection, logistics & Treatment requirements for WEEE - Part 1: General treatment requirements
€88.00
Electrical connectors and plug-and-socket devices - Ethernet connectors for data transmissions with threaded coupling (IP X7), up to 60 V - Part 2: Mounting, detail standard; Text in German and English
€91.03
Connectors for electronic equipment. Product requirements Circular connectors. Detail specification circular connectors with M8 screw-locking or snap-locking
€316.00
Universal serial bus interfaces for data and power - Part 4: Universal Serial Bus Cables and Connectors Class Document, Revision 2.0 (IEC 62680-4:2013); English version EN 62680-4:2014
€140.00
Connecteurs pour équipements électroniques - Exigences de produit - Partie 2-109 : connecteurs circulaires - Spécification particulière relative aux connecteurs avec verrouillage à vis M 12 x 1, pour les transmissions de données à des fréquences jusqu'à 500 MHz
€126.00
Connectors for electronic equipment. Product requirements Circular connectors. Detail specification connectors with M 12 × 1 screw-locking, data transmission frequencies up to 500 MHz
Spécification intermédiaire : connecteurs restangulaires pour fréquences inférieures à 3 MHz
€153.00
Collection, logistic and treatment requirements for WEEE - Part 1 : general treatment requirements
€69.00
Détail specification : circular connectors - Round contacts, size diameter 1,6 mm, threaded coupling
Connectors for electronic equipment - Product requirements - Part 2-109: Circular connectors - Detail specification for connectors with M 12 x 1 screw-locking, for data transmission frequencies up to 500 MHz
€231.00
Connectors for electronic equipment. Product requirements Rectangular connectors. Sectional specification
€269.00
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
€105.42
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
€116.64
Solderless connections - Part 2: Crimped connections - General requirements, test methods and practical guidance (IEC 60352-2:2006 + A1:2013); German version EN 60352-2:2006 + A1:2013.
€157.10
