Product package labels for electronic components using bar code and two- dimensional symbologies (IEC 62090:2017); German version EN 62090:2017.
€122.34
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method (IEC 61967-4:2002 + A1:2006); German version EN 61967-4:2002 + A1:2006, Corrigendum to DIN EN 61967-4:2006-07, (IEC 61967-4:2002/COR1:2017); German version EN 61967-4:2002/AC:2017-07.
€0.00
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method (IEC 61967-6:2002 + A1:2008); German version EN 61967-6:2002 + A1:2008, Corrigendum to DIN EN 61967-6:2008-10; (IEC-Cor. :2010 to IEC 61967-6:2002)
EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) (IEC 62433-2:2008); German version EN 62433-2:2010.
€140.00
Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method (IEC 47A/839/CD:2010)
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009); German version EN 60747-16-3:2002 + A1:2009.
€145.14
Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010); German version EN 62417:2010
€63.27
Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method (IEC 62132-4:2006); German version EN 62132-4:2006
€98.32
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (IEC 61967-2:2005); German version EN 61967-2:2005
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions (IEC 61967-1:2002); German version EN 61967-1:2002.
Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)
€69.91
Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (IEC 47/2172/CD:2013)
€116.64
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration Mechanisms (IEC 47/2173/CD:2013)
€84.58
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die & Wafer Devices (IEC 47/2174/CD:2013)
Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases (IEC 62435-9:2021); German version EN IEC 62435-9:2021
€91.03
