Packaging of components for automatic handling Matrix trays
€316.00
IEC TR 62240-2:2018 Process management for avionics - Electronic components capability in operation - Part 2: Semiconductor microcircuit lifetime
€231.00
Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
€127.00
Packaging of components for automatic handling - Part 5 : matrix trays
€138.00
IEEE Guide for Common Format for Naming Intelligent Electronic Devices (COMDEV)
€65.00
Surface mounting technology - Part 4 : classification, packaging, labelling and handling of moisture sensitive devices
€28.00
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Ball grid array (BGA) re-balling
Packaging of components for automatic handling - Part 5: Matrix trays
€286.00
Electrostatics Protection of electronic devices from electrostatic phenomena. User guide
€404.00
Process management for avionics. Electronic components capability in operation Temperature uprating
€374.00
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
€325.00
Essais d'environnement - Partie 2-58 : essais - Essai Td : méthodes d'essai de la soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de brasage des composants pour montage en surface (CMS)
€59.33
Determination of certain substances in electrotechnical products Mercury polymers, metals and electronics by CV-AAS, CV-AFS, ICP-OES ICP-MS
IEC TR 62240-1:2018 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
€369.00
Graphical symbols for diagrams. Guidance on design for standardization in IEC 60617
€193.00
