Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
€105.42
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
€84.58
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
€98.32
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011.
Ships and marine technology - System co-ordination plans in shipbuilding; Text in German and English
€128.22
Technical drawings - Relief grooves - Types and dimensions
€63.27
Technical product documentation - Building and civil engineering drawings - Part 6: Documentation of buildings and construction sites
€91.03
Technical drawings - Simplified drawing - Part 6: Collection drawings, directions for preparing
€34.30
Optics and photonics - Preparation of drawings for optical elements and systems; Supplement 1: Comparison DIN ISO 10110 - DIN 3140, Index
Manufacturing spigots (Butzen) of parts produced by lathes - indications on drawings
€48.79
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
Welding for aerospace applications - Welding data in design documents (ISO/DIS 17533:2013)
Technical drawings - Simplified representation and dimensioning of holes (ISO 15786:2008)
Graphical layout and documentation of wells and ground water measuring points
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013)
