Specification for audiovisual, video and television equipment systems audio cassette
€193.00
Harmonized system of quality assessment for electronic components. Blank detail specification: unidirectional transient overvoltage suppressor diodes
Mechanical standardization of semiconductor devices Recommendations for the preparation drawings
€316.00
Mechanical standardization of semiconductor devices Recommendations for the preparation outline drawings integrated circuits
€355.00
Mechanical standardization of semiconductor devices Recommendations for a coding system and classification into forms package outlines
€165.00
Mechanical standardization of semiconductor devices Recommendations for tape automated bonding (TAB) integrated circuits
€269.00
Mechanical standardization of semiconductor devices Specification for the preparation outline drawings surface mounted device packages
Mechanical standardization of semiconductor devices Schedule UK national drawings giving dimensions
€404.00
Modular order for the development of mechanical structures for electronic equipment practices
Printed wiring boards Guide for the production of artwork
Metal-clad base materials for printed wiring boards. Special used in connection with circuits Specification permanent polymer coating (solder resist) use the fabrication of boards
Harmonized system of quality assessment for electronic components. Sectional specification: rectangular connectors for frequencies below 3 MHz
Harmonized system of quality assessment for electronic components. Blank detail specification: case-rated rectifier diodes
Harmonized system of quality assessment for electronic components. Blank detail specification: ambient-rated rectifier diodes
Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: qualification approval procedure
