Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approval
€269.00
Harmonized system of quality assessment for electronic components. Electromechanical switches for use in electronic equipment. Sectional specification for pushbutton switches
€193.00
Harmonized system of quality assessment for electronic components. Electromechanical switches for use in electronic equipment. Sectional specification for lever (toggle) switches
€165.00
Printed wiring boards Specification for mass lamination panels (semi-manufactured multilayer printed boards)
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: electromechanical switches for use in electronic equipment. Blank detail specification for lever (toggle) switches
Harmonized system of quality assessment for electronic components. Electromechanical switches for use in electronic equipment. Generic specification
€316.00
Measuring method for chrominance signal-to-random noise ratio for video tape recorders
Harmonized system of quality assessment for electronic components. Electromechanical switches for use in electronic equipment. Sectional specification for in-line package switches
Harmonized system of quality assessment for electronic components. Generic specification: modular electronic units
Specifications Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication multilayer printed boards
Specification for radio data system (RDS)
€404.00
Harmonized system of quality assessment for electronic components. Electromechanical switches for use in electronic equipment. Sectional specification for rotary switches
Sound system equipment Specification for matching values the interconnection of sound components
Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approval
Modular order for the development of mechanical structures electronic equipment practices Guide users IEC Publication 60917
