Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress (HAST)
€165.00
Semiconductor devices. Mechanical and climatic test methods Vibration, variable frequency
Coaxial cables. Sectional specification for cables used in cabled distribution networks Indoor drop systems operating at 5 MHz - 1000
Public transport. Road vehicle scheduling and control systems General application rules for CANopen transmission busses
Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. telecom quality. Two change-over contacts, 11 mm x 7,5 (max.) base
€316.00
Electroacoustics. Octave-band and fractional-octave-band filters
Reed contacts unit Generic specification
€374.00
Solderless connections crimped connections. General requirements, test methods and practical guidance
Attachment materials for electronic assembly Requirements solder pastes high-quality interconnections in
€193.00
Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid solders soldering applications
Relays with forcibly guided (mechanically linked) contacts
Connectors for frequencies below 3 MHz use with printed boards Detail specification 8-way, shielded, free and fixed connectors, data transmission up to 600 (category 7, shielded)
€404.00
Semiconductor devices. Integrated circuits General
Connectors for frequencies below 3 MHz use with printed boards Detail specification 8-way, shielded free and fixed connectors common mating features, assessed quality
Public transport. Road vehicle scheduling and control systems CANopen cabling specifications
