Guidance on terms for connectors and mechanical structures in electronic equipment
€355.00
Soft soldering fluxes. Test methods Flux efficacy tests, wetting balance method
€269.00
Delay and power calculation standards Pre-layout delay specification for CMOS ASIC libraries
€316.00
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
€165.00
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitch land grid array (FLGA). Rectangular type
Semiconductor devices. Mechanical and climatic test methods
€404.00
Electromechanical all-or-nothing relays Sectional specification. telecom of assessed quality
Electromechanical all-or-nothing relays Blank detail specification. telecom of assessed quality. Non-standardized types and construction
Electromechanical all-or-nothing relays Blank detail specification. telecom of assessed quality. Two change-over contacts, 20 mm x 10 base
Electromechanical all-or-nothing relays Blank detail specification. telecom of assessed quality. Two change-over contacts, 14 mm x 9 base
Semiconductor devices. Mechanical and climatic test methods shock
Semiconductor devices. Mechanical and climatic test methods Salt atmosphere
Semiconductor devices. Mechanical and climatic test methods Internal moisture content measurement the analysis of other residual gases
Semiconductor devices. Mechanical and climatic test methods External visual examination
Semiconductor devices. Mechanical and climatic test methods Storage at high temperature
