Semiconductor die products Requirements for information concerning thermal simulation
€165.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials
€404.00
Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials
€193.00
Electroacoustics. Simulators of human head and ear 2 cm3 coupler for the measurement hearing aids earphones coupled to by means inserts
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape. Format D-7 VTR specifications
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape. Format D-7 Compression format
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape. Format D-7 Data stream format
€269.00
Multimedia systems and equipment. Colour measurement management printers. Reflective prints. RGB inputs
€355.00
Detail specification: rectangular connectors. Flat contacts, 0,8 mm thickness, locking screw not detachable
Cables for indoor residential telecommunication installations Screened cables. Grade 3
Printed board design, manufacture and assembly. Terms and definitions
Test methods for electrical materials, interconnection structures and assemblies materials used in manufacturing electronic
€316.00
Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
