Semiconductor die products XML schema for data exchange
€269.00
Integrated circuits. Measurement of impulse immunity Synchronous transient injection method
Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
€193.00
Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz Bulk current injection (BCI) method
Materials for printed boards and other interconnecting structures Copper-clad laminates flexible (adhesive non-adhesive types)
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength
Global maritime distress and safety system (GMDSS) Radar transponder. Marine search rescue (SART). Operational performance requirements, methods of testing required test results
Use of LED signal heads in road traffic signal systems
Communication cables Common design rules and construction. Halogen free flame retardant insulation compounds
€165.00
Public transport. Road vehicle scheduling and control systems WorldFIP message content
€404.00
Communication cables Common design rules and construction. PVC sheathing compounds
Public transport. Road vehicles. Visible variable passenger information devices inside the vehicle
Mechanical standardization of semiconductor devices Glossary tests and burn-in sockets for BGA, LGA, FBGA FLGA
Liquid crystal display devices (LCD) cells. Blank detail specification
