Test Method for Crystalographic Perfection of Silicon by Preferential Etch Techniques (Withdrawn 1998)
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Method for Measurement of Oxide Thickness on Silicon Wafers and Metallization Thickness by Multiple-Beam Interference (Tolansky Method) (Withdrawn 1993)
Test Method for Measuring Small-Signal Comon Emitter Current Gain of Transistors at High Frequencies (Withdrawn 1995)
Standard Specification for Nickel-Chromium-Iron Sealing Alloys (Withdrawn 2024)
Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals (Withdrawn 2023)
Standard Specification for Metallized Surfaces on Ceramic (Withdrawn 2023)
Standard Specification for Integrated Circuit Lead Frame Material (Withdrawn 2023)
Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications (Withdrawn 2024)
Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices (Withdrawn 2023)
Standard Specification for Gold Wire for Semiconductor Lead Bonding
Standard Test Method for Measuring the Force-Resistance of a Membrane Force Sensor (Withdrawn 2023)
Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure (Withdrawn 2023)
Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)
Standard Specification for Nickel-Chromium-Iron Sealing Alloys