F01 : Committee F01 on Electronics

ASTM F47-94

ASTM F47-94

Withdrawn Most Recent

Test Method for Crystalographic Perfection of Silicon by Preferential Etch Techniques (Withdrawn 1998)

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ASTM F388-84

ASTM F388-84

Withdrawn Most Recent

Method for Measurement of Oxide Thickness on Silicon Wafers and Metallization Thickness by Multiple-Beam Interference (Tolansky Method) (Withdrawn 1993)

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ASTM F632-90

ASTM F632-90

Withdrawn Most Recent

Test Method for Measuring Small-Signal Comon Emitter Current Gain of Transistors at High Frequencies (Withdrawn 1995)

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ASTM F31-21

ASTM F31-21

Withdrawn Most Recent

Standard Specification for Nickel-Chromium-Iron Sealing Alloys (Withdrawn 2024)

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ASTM F19-21

ASTM F19-21

Withdrawn Most Recent

Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals (Withdrawn 2023)

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ASTM F44-21

ASTM F44-21

Withdrawn Most Recent

Standard Specification for Metallized Surfaces on Ceramic (Withdrawn 2023)

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ASTM F375-20

ASTM F375-20

Withdrawn Most Recent

Standard Specification for Integrated Circuit Lead Frame Material (Withdrawn 2023)

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ASTM F1466-20

ASTM F1466-20

Withdrawn Most Recent

Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications (Withdrawn 2024)

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ASTM F1893-18

ASTM F1893-18

Withdrawn Most Recent

Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices (Withdrawn 2023)

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ASTM F72-17

ASTM F72-17

Superseded Historical

Standard Specification for Gold Wire for Semiconductor Lead Bonding

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ASTM F72-17e1

ASTM F72-17e1

Superseded Historical

Standard Specification for Gold Wire for Semiconductor Lead Bonding

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ASTM F3291-17

ASTM F3291-17

Withdrawn Most Recent

Standard Test Method for Measuring the Force-Resistance of a Membrane Force Sensor (Withdrawn 2023)

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ASTM F3290-17

ASTM F3290-17

Withdrawn Most Recent

Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure (Withdrawn 2023)

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ASTM F3192-16

ASTM F3192-16

Withdrawn Most Recent

Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)

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ASTM F31-16

ASTM F31-16

Superseded Historical

Standard Specification for Nickel-Chromium-Iron Sealing Alloys

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