Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
€35.00
Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
€28.00
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
€69.00
Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
€59.00
Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
€50.00
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
€53.00
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
€58.00
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
€64.00
Plasma display panels -- Part 3-1: Mechanical interface
€61.00
SEMICONDUCTOR DEVICES. PART 11: SECTIONAL SPECIFICATION FOR DISCRETE DEVICES.
IEC 822 VSB. PARALLEL SUB-SYSTEM BUS OF THE IEC 821 VMEBUS.
€157.00
LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED MICROCIRCUITS.
€91.00
Binary floating-point arithmetic for microprocessor systems
€62.00
