Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
€107.00
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
€47.00
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
€28.00
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
€40.00
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
€50.00
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
€35.00
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock.
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
€58.00
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
€60.00
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
