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IPC-TR-001 - Study/Technical Report:2006
TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology - Single User Download
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Summary
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.
Technical characteristics
| Publisher | IPC standards by Global Electronics Association |
| Publication Date | 01/01/2006 |
| Edition | 0 |
| Page Count | 38 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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