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IPC-SPVC-TAL1 - White Paper:2009

SPVC-TAL1: Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots

Summary

The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder.As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels:
  • Normal operation defined as the level one would expect contamination levels to be based on running steady state.
  • Increased Monitoring defined as a level that is not a danger but a level that indicates an upward trend that should be monitored more closely.
  • Adjust Pot defined as the level at which pot should be adjusted to insure reliable performance of the solder joints.
  • This report is free for IPC members.The 27 page research report provides the analysis of all the wetting and ring testing and provides a proposed recommendation of take action limit

    Technical characteristics

    Publisher IPC standards by Global Electronics Association
    Publication Date 11/12/2009
    Edition 0
    Page Count 0
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