IPC-2223F - Revision F - Standard Only:2026

Used in conjunction with the base IPC-2221 printed board design standard, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision F provides new design guidance and requirements for mechanical and physical layout, usage of nonfunctional lands, coverlay access for surface mounting, conductor routing and tradeoffs between panel, pattern and button (pads only) plating for surface and hole copper plating.