IEC TS 62647-2:2012
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IEC TS 62647-2:2012

IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

Summary

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 11/29/2012
Edition 1.0
Page Count 68
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Weight (in grams) ---
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