IEC TR 63378-1:2021
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IEC TR 63378-1:2021

IEC TR 63378-1:2021 Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Summary

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 12/14/2021
Edition 1.0
Page Count 20
EAN ---
ISBN ---
Weight (in grams) ---
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