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IEC 63378-2-1:2024
IEC 63378-2-1:2024 Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
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Summary
IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 10/22/2024 |
| Edition | 1.0 |
| Page Count | 15 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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