IEC 63068-1:2019
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IEC 63068-1:2019

IEC 63068-1:2019 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

Summary

IEC 63068-1:2019(E) gives a classification of defects in as-grown 4H-SiC (Silicon Carbide) epitaxial layers. The defects are classified on the basis of their crystallographic structures and recognized by non-destructive detection methods including bright-field OM (optical microscopy), PL (photoluminescence), and XRT (X-ray topography) images.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 01/30/2019
Edition 1.0
Page Count 23
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