Superseded
Standard
Historical
IEC 63055:2016
IEC 63055:2016 Format for LSI-Package-Board Interoperable design
Summary
IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/08/2016 |
| Edition | 1.0 |
| Page Count | 194 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
No products.
No products.