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IEC 62899-202-10:2023
IEC 62899-202-10:2023 Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
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Summary
IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/16/2023 |
| Edition | 1.0 |
| Page Count | 26 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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