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IEC 61189-2:2006

IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Summary

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 05/30/2006
Edition 2.0
Page Count 122
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ISBN ---
Weight (in grams) ---
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