IEC 61188-5-4:2007
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IEC 61188-5-4:2007

IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Summary

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 10/30/2007
Edition 1.0
Page Count 15
EAN ---
ISBN ---
Weight (in grams) ---
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