Superseded Standard
Historical

IEC 60691:2002+AMD1:2006+AMD2:2010 Consolidated

Thermal-links - Requirements and application guide

Summary

IEC 60691:2002+A1:2006+A2:2010 Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard. This consolidated version consists of the third edition (2002), its amendment 1 (2006) and its amendment 2 (2010). Therefore, no need to order amendments in addition to this publication.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 02/25/2010
Release Date 02/25/2010
Cancellation Date 10/08/2015
Edition 3.2
Page Count 154
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ISBN ---
Weight (in grams) ---
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