IEC 60191-6-6:2001
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IEC 60191-6-6:2001

IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Summary

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 03/22/2001
Edition 1.0
Page Count 12
EAN ---
ISBN ---
Weight (in grams) ---
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