IEC 60191-6-5:2001
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IEC 60191-6-5:2001

IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Summary

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 08/27/2001
Edition 1.0
Page Count 10
EAN ---
ISBN ---
Weight (in grams) ---
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