IEC 60191-6-4:2003
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IEC 60191-6-4:2003

IEC 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Summary

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 06/11/2003
Edition 1.0
Page Count 16
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ISBN ---
Weight (in grams) ---
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