IEC 60191-6-1:2001
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IEC 60191-6-1:2001

IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Summary

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 10/30/2001
Edition 1.0
Page Count 7
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ISBN ---
Weight (in grams) ---
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