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26/30568358 DC:2026
BS IEC 62047-63 Semiconductor devices - Micro-electromechanical systems Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/31/2026 |
| Page Count | 17 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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01/04/1996
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08/08/2024
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