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25/30510059 DC:2025
BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages Part 2-2: 3D thermal simulation models of for steady-state analysis - PBGA and FBGA
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 02/07/2025 |
| Page Count | 29 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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01/04/1996
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08/08/2024
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