Printed board assemblies Sectional specification. Requirements for terminal soldered
€269.00
Connectors for electrical and electronic equipment. Product requirements Detail specification 8-way, shielded, free fixed connectors I/O Gigabit Ethernet applications in harsh environments
€316.00
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance test methods
Mechanical structures for electrical and electronic equipment. Thermal management cabinets in accordance with IEC 60297 60917 series Method the determination of forced air cooling structure
Mechanical structures for electrical and electronic equipment. Aisle containment IT cabinets Details of air flow, separation cooling requirements
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test metal materials with surface processing
€193.00
Surface mounting technology Standard method for the specification of surface components (SMDs)
€355.00
Mechanical structures for electrical and electronic equipment. Outdoor enclosures Design guidelines
Mechanical structures for electrical and electronic equipment. Outdoor enclosures Environmental requirements, tests safety aspects
Modular order for the development of mechanical structures electrical and electronic equipment practices Generic standard
Recommendations for shielded enclosures
Mechanical structures for electronic equipment. Dimensions of mechanical the 482,6 mm (19 in) series Adaptation dimensions subracks and chassis applicable with metric cabinets or racks in accordance IEC 60917-2-1
Modular order for the development of mechanical structures electronic equipment practices Sectional specification. Interface coordination dimensions 25 mm practice. Adaptation subracks or chassis applicable in cabinets racks accordance with IEC 60297-3-100 (19 in)
Instrument transformers Additional requirements for inductive voltage
