Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-12: Climatic tests; test 11m: Damp heat, cyclic (IEC 48B/847/CD:1999)
€41.78
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-13: Climatic tests; tests 11n: Gas thightness, colderless wrapped connections (IEC 48B/848/CD:1999)
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
€98.32
Composants électromécaniques pour équipements électroniques - Procédures d'essai de base et méthodes de mesure - Partie 1 : généralités. Section 4 : essai 1d : efficacité de la protection des contacts (scoop-proof)
€58.00
Development of mechatronic and cyber-physical systems
€184.70
Manufacturing of mechatronic integrated devices (MID)
€83.76
Manufacturing of mechatronic integrated devices (MID) - Laser direct structuring
€103.98
Design methodology for mechatronic systems
€298.13
Exigences de collecte, logistique et traitement pour les déchets d’équipements électriques et électroniques (DEEE) - Partie 1 : Exigences générales du traitement
€87.00
Development of cyber-physical mechatronic systems (CPMS)
€128.28
IEC 60512-1-4:1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof)
€23.00
IEC 60512-14-7:1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 14: Sealing tests - Section 7: Test 14g: Impacting water
€12.00
